The MUST System 3 is the latest technological evolution of the original Multicore Universal Solderability Tester (MUST) that grandfathered all modern solderability test standards. It remains the unquestioned industry benchmark for solderability testing. The MUST was originally developed by collaboration through an EU “Bright Project” together with NPL, Siemens and Philips. The NPL continue to assist in development of this test method. Capable of measuring down to 0.001mN the MUST is THE most accurate and comprehensively equipped test system of its type in the world. Gen3 actively participates in standards development work with IEC, IPC, ISO, BSI and other official standards authorities to help maintain and develop solderability metrology. The MUST 3 sets the standard – it performs solderability testing in accordance with all major international standards and comprises everything necessary for all forms of solderability tests.

The JetEtch decapsulation system takes an integrated circuit encapsulated in mold compound and removes it using a user-specified chemical solution. The process of mold compound removal is called “decapsulation” and is often referred-to as “decapping,” “Jet-Etching,” and similar. The results of this process can be used in a number of ways but are most commonly seen in semiconductor failure analysis and counterfeit protection during the verification process. Without exposing the die in an integrated circuit, verifying a part’s authenticity is virtually impossible. Die exposure is also critical to the failure analysis industry, as a die in this state lends itself best to a wide number of types of tests.